Effect of copper addition on the properties of electroless Ni-Cu-P coating on heat transfer surface
Crossref DOI link: https://doi.org/10.1007/s00170-014-6437-8
Published Online: 2014-10-10
Published Print: 2015-02
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Cheng, Y. H.
Chen, S. S.
Jen, T. C.
Zhu, Z. C.
Peng, Y. X.
Text and Data Mining valid from 2014-10-10