Thermal analysis of chip formation using FEM and a hybrid explicit-implicit approach
Crossref DOI link: https://doi.org/10.1007/s00170-014-6458-3
Published Online: 2014-10-12
Published Print: 2015-03
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Coelho, R. T.
de Oliveira, J. F. G.
Nascimento, Claudia Hespanholo
Text and Data Mining valid from 2014-10-12