Micro-structures and tensile properties of copper-wire-reinforced Sn–Bi alloy micro-composite fabricated by micro-ultrasonic powder moulding
Crossref DOI link: https://doi.org/10.1007/s00170-015-6859-y
Published Online: 2015-02-21
Published Print: 2015-07
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Wu, Shi-yun
Wu, Xiao-yu
Xu, Bin
Chen, Xiao-qiang
Cheng, Rong
Ruan, Shuang-chen
Text and Data Mining valid from 2015-02-21