Development of hybrid process for double-side flexible printed circuit boards using roll-to-roll gravure printing, via-hole printing, and electroless plating
Crossref DOI link: https://doi.org/10.1007/s00170-015-7507-2
Published Online: 2015-07-14
Published Print: 2016-02
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Park, Janghoon
Lee, Jongsu
Park, Sungsik
Shin, Kee-Hyun
Lee, Dongjin
Text and Data Mining valid from 2015-07-14