Modeling and analysis of the grit level interaction in diamond wire sawing of silicon
Crossref DOI link: https://doi.org/10.1007/s00170-015-7771-1
Published Online: 2015-09-05
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Wu, Hao
Yang, Chris
Melkote, Shreyes
Text and Data Mining valid from 2015-09-05
