Comparison of bending fracture strength of silicon after ablation with nanosecond and picosecond lasers
Crossref DOI link: https://doi.org/10.1007/s00170-015-7857-9
Published Online: 2015-09-24
Published Print: 2016-06
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Noh, Jiwhan
Kim, Jae-Hyun
Sohn, Hyonkee
Lee, Jae-Hoon
Text and Data Mining valid from 2015-09-24