A material removal rate model-based chemical action of ultra-thin SUS304 substrate in chemical mechanical polishing
Crossref DOI link: https://doi.org/10.1007/s00170-015-7938-9
Published Online: 2015-10-13
Published Print: 2016-07
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Wei, Xin
Yang, Xiangdong
Xie, Xiaozhu
Hu, Wei
Text and Data Mining valid from 2015-10-13
