Experimental research on KDP crystal slicing with resin bonded diamond abrasive wire saw
Crossref DOI link: https://doi.org/10.1007/s00170-016-8577-5
Published Online: 2016-03-10
Published Print: 2016-11
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Ge, Mengran
Bi, Wenbo
Ge, Peiqi
Bi, Yuchao
Funding for this research was provided by:
National Natural Science Foundation of China (CN) (51075240)
Shandong Provincial Natural Science Foundation, China (ZR2014EEM034)
Text and Data Mining valid from 2016-03-10