Crossmark

Influence of fixed abrasive configuration on the polishing process of silicon wafers

Crossref DOI link: https://doi.org/10.1007/s00170-016-8808-9

Published Online: 2016-04-26

Published Print: 2017-01

Update policy: https://doi.org/10.1007/springer_crossmark_policy

Authors

Fang, Congfu

Zhao, Zaixing

Lu, Longyuan

Lin, Yanfen
Funding

Funding for this research was provided by:

National Natural Science Foundation of China (51305145)

National Natural Science Foundation of China (CN) (U1305241)

the Project of Natural Science Foundation of Fujian Province (2016J01235)

Promotion Program for Young and Middle-aged Teacher in Science and Technology Research of Huaqiao University (ZQN-PY303)
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