Depth of cut for single abrasive and cutting force in resin bonded diamond wire sawing
Crossref DOI link: https://doi.org/10.1007/s00170-016-8896-6
Published Online: 2016-05-23
Published Print: 2017-02
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Liu, Tengyun
Ge, Peiqi
Gao, Yufei
Bi, Wenbo
Funding for this research was provided by:
Shandong Provincial Natural Science Foundation of China (ZR2014EEM034)
National Natural Science Foundation of China (51075240, 51205234)
Text and Data Mining valid from 2016-05-23