Development of hot embossing stamps with conformal cooling channels for microreplication
Crossref DOI link: https://doi.org/10.1007/s00170-016-8970-0
Published Online: 2016-06-04
Published Print: 2017-02
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Kuo, Chil-Chyuan
Chen, Bing-Cheng
Funding for this research was provided by:
Ministry of Science and Technology of Taiwan (MOST 103-2221-E-131-01)
License valid from 2016-06-04