Establishing a theoretical model for abrasive removal depth of silicon wafer chemical mechanical polishing by integrating a polishing times analytical model and specific down force energy theory
Crossref DOI link: https://doi.org/10.1007/s00170-016-9345-2
Published Online: 2016-09-03
Published Print: 2018-04
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Lin, Zone-Ching
Wang, Ren-Yuan
Jhang, Zih-Wun
Funding for this research was provided by:
Ministry of Science and Technology, Taiwan (MOST 103-2221-E-011 -027)
License valid from 2016-09-03