Mechanism of compound fracture and removal in grinding process for low-expansion glass ceramics
Crossref DOI link: https://doi.org/10.1007/s00170-016-9915-3
Published Online: 2017-01-03
Published Print: 2017-07
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Ma, Lianjie http://orcid.org/0000-0002-1283-8367
Yu, Aibing
Gu, Lichen
Wang, Hua
Chen, Jie
Funding for this research was provided by:
National Natural Science Foundation of China (CN) (51275083)
License valid from 2017-01-03