Development of low-cost hot embossing stamps with long life span and environmental protection
Crossref DOI link: https://doi.org/10.1007/s00170-016-9953-x
Published Online: 2016-12-28
Published Print: 2017-07
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Kuo, Chil-Chyuan http://orcid.org/0000-0003-0519-4126
Lyu, Shin-Yun
License valid from 2016-12-28