Crossmark

Experiments and reliability research on bonding process of micron copper wire and nanometer gold layer

Crossref DOI link: https://doi.org/10.1007/s00170-017-0490-z

Published Online: 2017-05-09

Published Print: 2017-10

Update policy: https://doi.org/10.1007/springer_crossmark_policy

Authors

Zhang, W. W.

Cong, S.

Wen, Z. J.

Liu, Y.

Wang, Y. S.

Tian, Y. H.
License Information

License valid from 2017-05-09