Crossmark

Investigation on the formation of surface defects of OFHC copper in diamond micro-grooving process

Crossref DOI link: https://doi.org/10.1007/s00170-017-0848-2

Published Online: 2017-08-02

Published Print: 2017-12

Update policy: https://doi.org/10.1007/springer_crossmark_policy

Authors

Han, J. D.

Li, L. H.

Chan, C. Y.

Lee, W. B.
Funding

Funding for this research was provided by:

Hong Kong Polytechnic University (RTTR)

Shenzhen Science and Technology Innovation Commission (JCYJ20150630115257902)
License Information

License valid from 2017-08-02