Experimental research on semiconductor shaping by abrasive-spark hybrid machining
Crossref DOI link: https://doi.org/10.1007/s00170-017-1013-7
Published Online: 2017-09-06
Published Print: 2018-02
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Zhou, Weiwei
Liu, Zhidong
Zhang, Bin
Qiu, Mingbo
Chen, Haoran
Shen, Lida
Funding for this research was provided by:
National Natural Science Foundation of China (51575271, 51675272, U1532106)
License valid from 2017-09-06