Modeling and analysis of wire motion during rocking mode diamond wire sawing of mono-crystalline alumina oxide wafer
Crossref DOI link: https://doi.org/10.1007/s00170-017-1327-5
Published Online: 2017-12-12
Published Print: 2018-04
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Chen, Chao-Chang A.
Gupta, Ajay
Funding for this research was provided by:
Ministry of Science and Technology, Taiwan (104B0223-1)
License valid from 2017-12-12