A new processing technique for fabrication of ultra-thin wafer
Crossref DOI link: https://doi.org/10.1007/s00170-017-1519-z
Published Online: 2018-01-13
Published Print: 2019-02
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Zeng, Yibo
Zhang, Jie
Zhou, Hui
Guo, Hang
Text and Data Mining valid from 2018-01-13
Article History
Received: 31 May 2017
Accepted: 18 December 2017
First Online: 13 January 2018