Diamond structure-dependent pad and wafer polishing performance during chemical mechanical polishing
Crossref DOI link: https://doi.org/10.1007/s00170-018-1956-3
Published Online: 2018-04-06
Published Print: 2018-07
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Shin, Cheolmin
Kulkarni, Atul
Kim, Kangjun
Kim, Hojoong
Jeon, Sanghuck
Kim, Eungchul
Jin, Yinhua
Kim, Taesung
Text and Data Mining valid from 2018-04-06
Article History
Received: 20 September 2017
Accepted: 23 March 2018
First Online: 6 April 2018