Experimental analysis and numerical simulation of sintered micro-fluidic devices using powder hot embossing process
Crossref DOI link: https://doi.org/10.1007/s00170-018-2509-5
Published Online: 2018-08-16
Published Print: 2018-11
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Sahli, M.
Mamen, B.
Ou, H.
Gelin, J.-C.
Barrière, T.
Assoul, M.
Text and Data Mining valid from 2018-08-16
Article History
Received: 2 February 2017
Accepted: 24 July 2018
First Online: 16 August 2018