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Study on diamond wire wear, surface quality, and subsurface damage during multi-wire slicing of c-plane sapphire wafer

Published Online: 2018-10-09

Published Print: 2019-02

Authors

Gupta, Ajay

Chen, Chao-Chang A.

Hsu, Hsien-Wei
Funding

Funding for this research was provided by:

Ministry of Science and Technology (MOST104-2221-E-011-104-MY3)
License Information

Text and Data Mining valid from 2018-10-09
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Article History

Received: 10 May 2018

Accepted: 29 August 2018

First Online: 9 October 2018

Document is current