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Sawing stress of SiC single crystal with void defect in diamond wire saw slicing

Crossref DOI link: https://doi.org/10.1007/s00170-019-03579-4

Published Online: 2019-03-28

Published Print: 2019-07

Update policy: https://doi.org/10.1007/springer_crossmark_policy

Authors

Gao, Yufei

Chen, Yang
Funding

Funding for this research was provided by:

National Natural Science Foundation of China (51875322)

Key Research and Development Program of Shandong Province, China (2016GGX103007, 2017GGX30139)

Postdoctoral Research Foundation of China (2017M622190)
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Article History

Received: 16 October 2018

Accepted: 11 March 2019

First Online: 28 March 2019