Single grain grinding: a novel approach to model the interactions at the grain/bond interface during grinding
Crossref DOI link: https://doi.org/10.1007/s00170-020-05219-8
Published Online: 2020-05-07
Published Print: 2020-04
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Denkena, Berend
Bouabid, Abdelhamid
Kroedel, Alexander
Funding for this research was provided by:
Niedersächsische Ministerium für Wissenschaft und Kultur
Text and Data Mining valid from 2020-04-01
Version of Record valid from 2020-05-07
Article History
Received: 3 January 2020
Accepted: 16 March 2020
First Online: 7 May 2020