Three-dimensional CFD simulation of the stencil printing performance of solder paste
Crossref DOI link: https://doi.org/10.1007/s00170-020-05636-9
Published Online: 2020-06-19
Published Print: 2020-06
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Rusdi, M. S.
Abdullah, M. Z.
Ishak, M. H. H.
Aziz, M. S. Abdul
Abdullah, M. K.
Rethinasamy, P.
Jalar, A.
Text and Data Mining valid from 2020-06-01
Version of Record valid from 2020-06-01
Article History
Received: 28 November 2019
Accepted: 11 June 2020
First Online: 19 June 2020