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Numerical study on curing-induced residual stress and deformation of adhesively bonded sandwich structures of dissimilar materials

Published Online: 2022-02-11

Published Print: 2022-05

Authors

Li, Jianjun

Zhu, Wenfeng

Li, Yuanhui

Tang, Genglin
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Text and Data Mining valid from 2022-02-11

Version of Record valid from 2022-02-11
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Article History

Received: 7 May 2021

Accepted: 30 November 2021

First Online: 11 February 2022

Declarations

:

: The authors declare no competing interests.

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