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An adaptive genetic algorithm optimize neural networks approach for wafer dicing saw quality prediction

Published Online: 2022-11-22

Published Print: 2023-01

Authors

Shi, Jun

Du, Sihan https://orcid.org/0000-0001-6921-0514
Shi, Yunpeng

Cao, Weifeng

Zhou, Lintao
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Text and Data Mining valid from 2022-11-22

Version of Record valid from 2022-11-22
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Article History

Received: 12 April 2022

Accepted: 5 November 2022

First Online: 22 November 2022

Declarations

:

: The authors declare no competing interests.

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