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Modeling of material removal in copper blanket wafer polishing based on the hard polishing pad microstructure

Published Online: 2023-08-31

Published Print: 2023-10

Authors

Huy, Le Nam Quoc https://orcid.org/0000-0002-2015-4272
Hoa, Le Ngoc Quynh

Chen, Chao-Chang A.
Funding

Funding for this research was provided by:

Ministry of Science and Technology, Taiwan (MOST 109-2221-E-011 -001 -MY2)
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Text and Data Mining valid from 2023-08-31

Version of Record valid from 2023-08-31
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Article History

Received: 2 June 2023

Accepted: 21 August 2023

First Online: 31 August 2023

Declarations

:

: Not applicable.

: The authors declare no competing interests.

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