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Study of stress distribution in the various interfaces present in the 3D printing microelectronic systems: applies to boxes produced by additive manufacturing

Crossref DOI link: https://doi.org/10.1007/s00170-024-14484-w

Published Online: 2024-09-30

Update policy: https://doi.org/10.1007/springer_crossmark_policy

Authors

Houmimi, Mohamed

Benaissa, Hamza Ait

Zaghar, Hamid

Moujibi, Nabil

Sossey‑Alaoui, Ismail

Ziat, Abderrazak
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Text and Data Mining valid from 2024-09-30

Version of Record valid from 2024-09-30
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Article History

Received: 27 March 2024

Accepted: 15 September 2024

First Online: 30 September 2024

Declarations

:

: All authors allowed the publication of the final manuscript.

: The authors declare no competing interests.

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