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Investigation of ultrasonic joining parameters affecting the joining quality of Cu wire to Cu pads in lithium battery electrical circuits

Published Online: 2025-05-30

Published Print: 2025-06

Authors

Cheng, Yu-Chi

Wen, Chih-Ying

Chuang, Cheng-Li https://orcid.org/0000-0001-8795-2394
Funding

Funding for this research was provided by:

National Science and Technology Council (NSC-107-2221-E-040-005)
License Information

Text and Data Mining valid from 2025-05-30

Version of Record valid from 2025-05-30
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Article History

Received: 29 January 2025

Accepted: 22 May 2025

First Online: 30 May 2025

Declarations

:

: The authors declare no competing interests.

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