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Finite element modeling and multi-objective optimization of 4 H-SiC wafer cutting using nanosecond UV laser: quality prediction and experimental validation

Crossref DOI link: https://doi.org/10.1007/s00170-025-17092-4

Published Online: 2025-12-13

Published Print: 2026-01

Update policy: https://doi.org/10.1007/springer_crossmark_policy

Authors

Pan, Cheng-Tang

Lin, Ju-Yueh

Liu, Yu-Chi

Wang, Shao-Yu

Lin, Chen-Han

Lee, Ming-Chan
Funding

Funding for this research was provided by:

National Science and Technology Council (113-2222-E-992-007-)

National Science and Technology Council (111-2222-E-110-005-MY3)
License Information

Text and Data Mining valid from 2025-12-13

Version of Record valid from 2025-12-13
More Information

Article History

Received: 10 August 2025

Accepted: 20 November 2025

First Online: 13 December 2025

Declarations

:

: This article does not contain any studies with human participants or animals performed by any of the authors.

: Yes.

: The authors declare that they participated in this paper willingly.

: The authors declare no conflicts interest.

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