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Low-damage ductile removal of silicon carbide based on distributed undeformed chip thicknesses in composite ultrasonic vibration-assisted grinding (CUVAG)

Crossref DOI link: https://doi.org/10.1007/s00170-025-17290-0

Published Online: 2026-01-04

Published Print: 2026-01

Update policy: https://doi.org/10.1007/springer_crossmark_policy

Authors

Sun, Zhi

Dai, Chenwei

Miao, Qing

Yin, Zhen

Zhang, Ming

Chen, Jiajia
Funding

Funding for this research was provided by:

National Natural Science Foundation of China (51905363)

National Natural Science Foundation of China (52405506)
License Information

Text and Data Mining valid from 2026-01-01

Version of Record valid from 2026-01-01
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Article History

Received: 2 October 2025

Accepted: 17 December 2025

First Online: 4 January 2026

Declarations

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: The publisher has the permission of the authors to publish the given article.

: It is confirmed that all the authors are aware and satisfied of the authorship order and correspondence of the paper.

: The authors declare no competing interests.

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