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A robust LSTM-based defect identification methodology for imbalanced data of solder paste inspection

Published Online: 2026-02-03

Published Print: 2026-02

Authors

Chiang, Tzu-An

Che, Zhen-Hua https://orcid.org/0000-0001-5678-6354
Chen, Wei-Chien
Funding

Funding for this research was provided by:

National Taipei University of Technology
License Information

Text and Data Mining valid from 2026-02-01

Version of Record valid from 2026-02-03
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Article History

Received: 23 September 2025

Accepted: 30 December 2025

First Online: 3 February 2026

Declarations

:

: The authors declare that they have no known competing financial interests or personal relationships that could have appeared to influence the work reported in this paper.

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