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An industrial X-ray inspection framework for SMT solder bridge detection in BGA assemblies

Crossref DOI link: https://doi.org/10.1007/s00170-026-17943-8

Published Online: 2026-03-21

Published Print: 2026-04

Update policy: https://doi.org/10.1007/springer_crossmark_policy

Authors

Zhou, Xiran https://orcid.org/0009-0007-6491-0707
License Information

Text and Data Mining valid from 2026-03-21

Version of Record valid from 2026-03-21
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Article History

Received: 29 January 2026

Accepted: 18 March 2026

First Online: 21 March 2026

Declarations

:

: The author declares that there is no conflict of interest.