Crossmark

Modular assembly system for multi-dimensional 3D-structured hollow microneedle array device

Published Online: 2026-05-01

Authors

Fu, Xingyu https://orcid.org/0000-0002-2543-3975
O’Toole, Lorcan

Zhang, Jufan
Funding

Funding for this research was provided by:

University College Dublin
License Information

Text and Data Mining valid from 2026-05-01

Version of Record valid from 2026-05-01
More Information

Article History

Received: 1 November 2025

Accepted: 25 April 2026

First Online: 1 May 2026

Declarations

:

: The authors declare that they have no conflict of interest.

Document is current