Organic substrate high-voltage performance: plausible capacitive isolation technology in integrated circuit package bill of materials
Crossref DOI link: https://doi.org/10.1007/s00202-019-00840-7
Published Online: 2019-10-04
Published Print: 2019-09
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Tuncer, Enis http://orcid.org/0000-0002-9324-4324
Gupta, Mohan
Heussner, Daryl
O’Connor, Shawn
Tran, Thu
Text and Data Mining valid from 2019-09-01
Version of Record valid from 2019-09-01
Article History
Received: 17 January 2018
Accepted: 24 September 2019
First Online: 4 October 2019