Numerical investigations on the effects of different cooling periods in reflow-soldering process
Crossref DOI link: https://doi.org/10.1007/s00231-015-1506-6
Published Online: 2015-02-08
Published Print: 2015-10
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Srivalli, C.
Abdullah, M. Z.
Khor, C. Y.
Text and Data Mining valid from 2015-02-08