Characterization of a high performance ultra-thin heat pipe cooling module for mobile hand held electronic devices
Crossref DOI link: https://doi.org/10.1007/s00231-017-2022-7
Published Online: 2017-03-24
Published Print: 2017-11
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Ahamed, Mohammad Shahed
Saito, Yuji
Mashiko, Koichi
Mochizuki, Masataka
License valid from 2017-03-24