Investigation of amorphous RuMoC alloy films as a seedless diffusion barrier for Cu/p-SiOC:H ultralow-k dielectric integration
Crossref DOI link: https://doi.org/10.1007/s00339-015-9219-8
Published Online: 2015-05-10
Published Print: 2015-08
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Jiao, Guohua
Liu, Bo
Li, Qiran
Text and Data Mining valid from 2015-05-10