Microstructure characterization and thermal behavior around crack tip under electropulsing
Crossref DOI link: https://doi.org/10.1007/s00339-015-9383-x
Published Online: 2015-08-08
Published Print: 2015-10
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Wei, Shaopeng
Wang, Gang
Deng, Dewei
Rong, Yiming
Funding for this research was provided by:
National Basic Research Program of China (2011CB013404)
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