Crossmark

Void shrinking process and mechanisms of the diffusion bonded Ti–6Al–4V alloy with different surface roughness

Crossref DOI link: https://doi.org/10.1007/s00339-015-9546-9

Published Online: 2015-12-23

Published Print: 2016-01

Update policy: https://doi.org/10.1007/springer_crossmark_policy

Authors

Li, H.

Li, M. Q.

Kang, P. J.
Funding

Funding for this research was provided by:

National Natural Science Foundation of China (51505386)

National Natural Science Foundation of China (51275416)

China Postdoctoral Science Foundation (2014M562447)

the Research Fund of the State Key Laboratory of Solidification Processing (NWPU), China (16-BZ-2015)
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