Thermal stability of amorphous tungsten/tungsten nitride synthesis using HFCVD as a diffusion barrier for copper
Crossref DOI link: https://doi.org/10.1007/s00339-016-0045-4
Published Online: 2016-04-14
Published Print: 2016-05
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Asgary, Somayeh
Hantehzadeh, Mohammad Reza
Ghoranneviss, Mahmood
Boochani, Arash
Text and Data Mining valid from 2016-04-14