Stress induced grain boundaries in thin Co layer deposited on Au and Cu
Crossref DOI link: https://doi.org/10.1007/s00339-016-0432-x
Published Online: 2016-09-21
Published Print: 2016-10
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Zientarski, Tomasz
Chocyk, Dariusz
License valid from 2016-09-21