Effect of cooling condition and Ag on the growth of intermetallic compounds in Sn-based solder joints
Crossref DOI link: https://doi.org/10.1007/s00339-016-0543-4
Published Online: 2016-11-28
Published Print: 2016-12
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Ma, Haoran
Kunwar, Anil
Guo, Bingfeng
Sun, Junhao
Jiang, Chengrong
Wang, Yunpeng
Song, Xueguan
Zhao, Ning
Ma, Haitao
Funding for this research was provided by:
National Natural Science Foundation of China (51571049, 51301030)
License valid from 2016-11-28