Document is current

Any future updates will be listed below

Effects of post-reflow cooling rate and thermal aging on growth behavior of interfacial intermetallic compound between SAC305 solder and Cu substrate

Crossref DOI link: https://doi.org/10.1007/s00339-016-9893-1

Published Online: 2016-03-07

Published Print: 2016-04

Update policy: https://doi.org/10.1007/springer_crossmark_policy

About CrossMark