Dry-adhesives based on hierarchical poly(methyl methacrylate) electrospun fibers
Crossref DOI link: https://doi.org/10.1007/s00339-017-0816-6
Published Online: 2017-02-21
Published Print: 2017-03
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Sahay, Rahul
Baji, Avinash
Parveen, Hashina
Ranganath, Anupama Sargur
Funding for this research was provided by:
SUTD-MIT International Design Centre (IDG31400101)
License valid from 2017-02-21