Structural and thermal performance of Ag, Ni, and Ag/Ni thin films as thermal interface material for light-emitting diode application
Crossref DOI link: https://doi.org/10.1007/s00339-017-0886-5
Published Online: 2017-03-24
Published Print: 2017-04
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Shanmugan, Subramani
Jassriatul, Aida Nur
Mutharasu, Devarajan
License valid from 2017-03-24