Crossmark

Influence of Zn additions on the interfacial reaction and microstructure of Sn37Pb/Cu solder joints

Crossref DOI link: https://doi.org/10.1007/s00339-017-1244-3

Published Online: 2017-09-15

Published Print: 2017-10

Update policy: https://doi.org/10.1007/springer_crossmark_policy

Authors

Qiu, Yu

Hu, Xiaowu

Li, Yulong

Jiang, Xiongxin
Funding

Funding for this research was provided by:

the Nature Science Foundation of China (No.51465039)

Nature Science Foundation of Jiangxi Province (20151BAB206041, 20161BAB206122)

Fund of the State Key Laboratory of Solidification Processing in NWPU (SKLSP201508)
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