Ultrafast-laser dicing of thin silicon wafers: strategies to improve front- and backside breaking strength
Crossref DOI link: https://doi.org/10.1007/s00339-017-1374-7
Published Online: 2017-11-08
Published Print: 2017-12
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Domke, Matthias
Egle, Bernadette
Stroj, Sandra
Bodea, Marius
Schwarz, Elisabeth
Fasching, Gernot
Text and Data Mining valid from 2017-11-08
Article History
Received: 11 September 2017
Accepted: 31 October 2017
First Online: 8 November 2017