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Application of AlMgGaLi foil for joining copper to SiCp/Al-MMCs for high-temperature and high-power electronics

Published Online: 2019-08-03

Published Print: 2019-08

Authors

Chen, Biqiang https://orcid.org/0000-0001-7783-1185
Chen, Zhong

Du, Zehui

Zhang, Guifeng
Funding

Funding for this research was provided by:

National Natural Science Foundation of China (51275390)
License Information

Text and Data Mining valid from 2019-08-01

Version of Record valid from 2019-08-01
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Article History

Received: 19 June 2019

Accepted: 29 July 2019

First Online: 3 August 2019

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